KLA Corp (KLAC) operating KPIs
KLACNasdaqOptical Instruments & LensesFiscal year ends June 30
Financials through Q1 FY2027, quarter ended Sep 30, 2026Last filing: 10-Q on Oct 29, 2026Score 16/3021% above fair value
$157.91−9.52 (-5.69%)
Close on Oct 30, 2026Market cap $206.32BP/E 39.5Yield 0.51%
KLA specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment revenue ($M)
4% of Q4 FY26 revenue ($159.7M, +13% YoY, -3% QoQ); $24.4M segment profit.
Latest, Q4 FY26
160
Period ended Jun 30, 2026
Change on a year earlier
+12.5%
142 in Q4 FY25
History
32 quarters
Since Q1 FY19
Sources
26
Documents cited below
Quarterly history
Hover a value to see the sentence it was read from; calculated values show their formula
Breakdown
What makes up specialty semiconductor process (advanced packaging, etch/deposition for mems/rf/power) — segment revenue
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Share of total revenue (company-reported %)4.0% · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Revenue growth YoY (company-reported %)13.0% · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Revenue growth QoQ (company-reported %)-3.0% · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment profit (gross / operating profit before unallocated corporate items)24.4 · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment cost of revenues (ASU 2023-07 disclosure)81.6 · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment research & development (R&D) expense (ASU 2023-07)15.2 · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment selling, general & administrative (SG&A) expense (ASU 2023-07)12.5 · Q4 FY26
- Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Other segment expense / items (ASU 2023-07)26 · Q4 FY26
Cite this data
StockData. (2026). KLA Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment revenue ($M), quarterly Q1 FY19–Q4 FY26 [Data set]. Compiled from KLA SEC filings and investor materials. https://stockdatahq.com/stocks/klac/kpis/seg-ssp-rev
See every metric in the KLA KPI table. Data updated Oct 25, 2026.