KLA Corp (KLAC) operating KPIs

KLACNasdaqOptical Instruments & LensesFiscal year ends June 30

Financials through Q1 FY2027, quarter ended Sep 30, 2026Last filing: 10-Q on Oct 29, 2026Score 16/3021% above fair value

$157.91−9.52 (-5.69%)

Close on Oct 30, 2026Market cap $206.32BP/E 39.5Yield 0.51%

KPIs

Operating metrics that drive KLA's business · fiscal year ends June 30

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KLA's fiscal year ends June 30 — Q1 FY27 = Jul–Sep 2026.

Column labels

Metric	Q1 FY27 2026-09-30	Q4 FY26 2026-06-30	Q3 FY26 2026-03-31	Q2 FY26 2025-12-31	Q1 FY26 2025-09-30	Q4 FY25 2025-06-30	Q3 FY25 2025-03-31	Q2 FY25 2024-12-31	Q1 FY25 2024-09-30	Q4 FY24 2024-06-30	Q3 FY24 2024-03-31	Q2 FY24 2023-12-31

Total contract liabilities (deferred system & service revenue)($M)2		1,775	1,449	1,728	1,711	1,714	1,730	1,930	1,710	1,782	1,720	1,550
Current contract liabilities (expected to be recognized within 12 months)($M)2		1,537	1,197	1,457	1,424
Current contract liabilities — system sales (shipped awaiting acceptance / installation)($M)		933	621	858	819	817	868	1,073	877	986	995	884
Current contract liabilities — service contracts (multi-quarter maintenance billings)($M)		604	577	599	605	548	509	521	513	502	451	446
Non-current contract liabilities (unearned multi-year revenue > 12 months)($M)2		238	252	271	287	349	352	334	320	295	271	222
Expected to be recognized in 12 to 24 months($M)		163	171	184	198
Expected to be recognized in 24 months or more (up to 5 years)($M)		74.8	81	86.7	89.6
Customer deposits & advances — current (advance payments for future system shipments)($M)4		430	411	363	511	636	529	486	611	646	554	608
Customer deposits & advances — non-current($M)		3.80	9.70	7.50	8.20	6.80	27.9	56.5	71.6	99.8	123	173
Contract assets — current (unbilled revenue recognized prior to payment milestone)($M)1		132	101	93.1	124	105	99	82.3	71.4	69.3	87.6	101
Contract assets reclassified to accounts receivable upon billing($M)		6.10	6.60	37.3	47.2	3.20	4.60	15.6	35.4	5.60	12.9	15.8
Deferred cost of revenues (inventories shipped to customer fabs awaiting final acceptance)($M)		257	172	231	201	224	207	250	215	280	243	166
Cash flow from change in deferred system revenue & contract liabilities($M)		326	-279	17.2	-3	-15.7	-198	218	-72.8	65.5	165	287
Unconditional purchase commitments for inventory, optics & precision sub-assemblies($M)		5,970	4,830	2,750	2,500	2,420	2,380	2,310	2,290	2,170	2,100	2,100

Semiconductor Process Control systems — Foundry & Logic customer share (% of system revenue)(%)1		79.0%	62.0%	60.0%	74.0%	69.0%	71.0%	76.0%			64.0%	56.0%
Guided next-quarter Foundry & Logic share of Semi Process Control systems (%)(%)	73.0%	82.0%	60.0%	59.0%	75.0%	69.0%	73.0%	76.0%	80.0%	82.0%	60.0%	68.0%
Semiconductor Process Control systems — Memory customer share (% of system revenue)(%)3		21.0%	38.0%	40.0%	26.0%	31.0%	29.0%	24.0%			36.0%	44.0%
DRAM (including HBM) share within Memory systems (%)(%)		83.0%	86.0%	75.0%	79.0%	75.0%	76.0%	85.0%			88.0%	89.0%
NAND Flash share within Memory systems (%)(%)		17.0%	14.0%	25.0%	21.0%	25.0%	24.0%
Guided next-quarter Memory share of Semi Process Control systems (%)(%)2	27.0%	18.0%	40.0%	41.0%	25.0%	31.0%	27.0%	24.0%	20.0%	18.0%	40.0%	32.0%
Guided next-quarter DRAM share within Memory systems (%)(%)	90.0%	84.0%	85.0%	78.0%	79.0%	76.0%	75.0%	76.0%	83.0%	78.0%	85.0%	85.0%
Guided next-quarter NAND Flash share within Memory systems (%)(%)	10.0%	16.0%	15.0%	22.0%	21.0%	24.0%	25.0%	24.0%	17.0%	22.0%	15.0%	15.0%

Next-quarter total revenue guidance (midpoint)($M)1	4,000	3,575	3,350	3,225	3,150	3,075	3,000	2,950	2,750	2,500	2,300	2,450
Next-quarter revenue guidance range (+/- band)($M)	200	200	150	150	150	150	150	150	150	125	125	125
Next-quarter Non-GAAP gross margin guidance (midpoint)(%)2	62.5%	61.8%	61.8%	62.0%	62.0%	63.0%	62.0%	61.5%	61.5%	61.5%	61.5%	61.5%
Next-quarter Non-GAAP gross margin guidance (low end of range)(%)	61.5%	60.8%	60.8%	61.0%	61.0%	62.0%	61.0%	60.5%	60.5%	60.5%	60.5%	60.5%
Next-quarter Non-GAAP gross margin guidance (high end of range)(%)	63.5%	62.8%	62.8%	63.0%	63.0%	64.0%	63.0%	62.5%	62.5%	62.5%	62.5%	62.5%
Next-quarter GAAP gross margin guidance (midpoint)(%)2	61.6%	60.7%	60.6%	60.8%	60.7%	61.7%	60.6%	60.0%	59.9%	59.5%	59.4%	59.6%
Next-quarter GAAP gross margin guidance (low end of range)(%)	60.6%	59.7%	59.6%	59.8%	59.7%	60.7%	59.6%	59.0%	58.9%	58.5%	58.4%	58.6%
Next-quarter GAAP gross margin guidance (high end of range)(%)	62.6%	61.7%	61.6%	61.8%	61.7%	62.7%	61.6%	61.0%	60.9%	60.5%	60.4%	60.6%
Next-quarter Non-GAAP operating expenses guidance($M)2	690	665	645	635	615	595	585	580	565	550	545	540
Next-quarter Non-GAAP other income & expense (OIE), net guidance (expense)($M)	25	25	25	32	33	35	36	33	34	38	45	45
Next-quarter Non-GAAP effective planning tax rate guidance(%)	14.5%	14.5%	14.5%	14.0%	13.5%	13.5%	13.5%	13.5%	13.5%	13.5%	13.5%	13.5%

Total consolidated revenue across reportable segments($M)6		3,658	3,415	3,297	3,210	3,175	3,063	3,077	2,842	2,569	2,360	2,487
Total revenue growth YoY (company-reported %)(%)		15.0%	11.0%	7.0%	13.0%	24.0%	30.0%	24.0%	19.0%	9.0%	-3.0%	-17.0%
Total revenue growth QoQ (company-reported %)(%)		7.0%	4.0%	3.0%	1.0%	4.0%	0.0%	8.0%	11.0%	9.0%	-5.0%	4.0%
Total reportable segment profit (before unallocated corporate costs)($M)		1,562	1,408	1,347	1,339	1,382	1,311	1,001	1,126	-1,076	1,412	1,557
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment revenue($M)8		3,257	3,084	3,005	2,899	2,878	2,739	2,756	2,575	2,308	2,096	2,194
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Share of total revenue (company-reported %)(%)		89.0%	90.0%	91.0%	90.0%	91.0%	89.0%	90.0%	90.0%	90.0%	89.0%	88.0%
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Revenue growth YoY (company-reported %)(%)		13.0%	13.0%	9.0%	13.0%	25.0%	31.0%	26.0%	21.0%	10.0%	-3.0%	-17.0%
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Revenue growth QoQ (company-reported %)(%)		6.0%	3.0%	4.0%	1.0%	5.0%	-1.0%	7.0%	12.0%	10.0%	-4.0%	3.0%
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment profit (gross / operating profit before unallocated corporate items)($M)		1,475	1,363	1,338	1,307	1,360	1,268	1,238	1,137	-381	1,344	1,418
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment cost of revenues (ASU 2023-07 disclosure)($M)		1,185	1,127	1,085	1,057	998	974	993	958
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment research & development (R&D) expense (ASU 2023-07)($M)		352	344	334	311	303	289	299	274
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment selling, general & administrative (SG&A) expense (ASU 2023-07)($M)		237	241	238	215	207	198	215	193
Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Other segment expense / items (ASU 2023-07)($M)		7.90	8.80	9.70	9.70	9.80	10.1	10.6	11.6
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment revenue($M)8		160	164	141	120	142	157	160	128	121	131	150
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Share of total revenue (company-reported %)(%)		4.0%	5.0%	4.0%	4.0%	4.0%	5.0%	5.0%	5.0%	5.0%	5.0%	6.0%
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Revenue growth YoY (company-reported %)(%)		13.0%	5.0%	-12.0%	-7.0%	17.0%	20.0%	7.0%	1.0%	-6.0%	2.0%	-5.0%
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Revenue growth QoQ (company-reported %)(%)		-3.0%	17.0%	17.0%	-16.0%	-9.0%	-2.0%	25.0%	6.0%	-7.0%	-13.0%	18.0%
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment profit (gross / operating profit before unallocated corporate items)($M)		24.4	23.4	10.8	6	23.5	33.4	29.1	13	-129	69.3	81.3
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment cost of revenues (ASU 2023-07 disclosure)($M)		81.6	88.5	73.7	61.5	67.4	72.7	79.3	63.8
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment research & development (R&D) expense (ASU 2023-07)($M)		15.2	13.8	16.9	13.5	12.9	12.8	11	10.3
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment selling, general & administrative (SG&A) expense (ASU 2023-07)($M)		12.5	11.5	11.9	11.4	10.9	10.4	13.8	13.9
Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Other segment expense / items (ASU 2023-07)($M)		26	26.8	27.3	27.3	27.2	27.2	27.3	27.3
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment revenue($M)8		241	168	152	190	154	169	161	138	140	133	143
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Share of total revenue (company-reported %)(%)		7.0%	5.0%	5.0%	6.0%	5.0%	6.0%	5.0%	5.0%	5.0%	6.0%	6.0%
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Revenue growth YoY (company-reported %)(%)		56.0%	-1.0%	-6.0%	37.0%	10.0%	26.0%	13.0%	1.0%	9.0%	1.0%	-16.0%
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Revenue growth QoQ (company-reported %)(%)		44.0%	10.0%	-20.0%	23.0%	-9.0%	5.0%	17.0%	-1.0%	5.0%	-7.0%	5.0%
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment profit (gross / operating profit before unallocated corporate items)($M)		62.7	21.3	-2.50	26.5	-1.40	10.4	-266	-24	-566	-0.90	57.2
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment cost of revenues (ASU 2023-07 disclosure)($M)		111	81	80.4	93.2	85.4	87.5	106	80.5
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment research & development (R&D) expense (ASU 2023-07)($M)		31.1	29.9	37	32.1	31.7	30.4	35.3	36
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment selling, general & administrative (SG&A) expense (ASU 2023-07)($M)		25.9	24	25.3	25.7	24.7	23.9	26.4	27.7
PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Other segment expense / items (ASU 2023-07)($M)		10.8	11.4	12	12	13.7	16.4	260	17.8
Revenue by Major Product & Service Category (6 disaggregation lines)($M)7		3,658	3,415	3,297	3,210	3,175	3,063	3,077	2,842	2,569	2,360	2,487
Wafer Inspection Systems (Broadband Plasma 39xx, Laser Scanning, e-Beam, Unpatterned) — Revenue($M)3		1,781	1,740	1,573	1,537	1,772	1,496	1,563	1,369	1,169	988	1,167
Wafer Inspection Systems (Broadband Plasma 39xx, Laser Scanning, e-Beam, Unpatterned) — Share of total revenue (company-reported %)(%)		49.0%	51.0%	48.0%	48.0%	56.0%	49.0%	51.0%	48.0%	46.0%	42.0%	47.0%
Wafer Inspection Systems (Broadband Plasma 39xx, Laser Scanning, e-Beam, Unpatterned) — Revenue growth YoY (company-reported %)(%)		1.0%	16.0%	1.0%	12.0%	52.0%	51.0%	34.0%	36.0%	23.0%	-4.0%	-7.0%
Wafer Inspection Systems (Broadband Plasma 39xx, Laser Scanning, e-Beam, Unpatterned) — Revenue growth QoQ (company-reported %)(%)		2.0%	11.0%	2.0%	-13.0%	18.0%	-4.0%	14.0%	17.0%	18.0%	-15.0%	15.0%
Patterning Systems (Overlay Metrology, Film/CD Metrology, Mask/Reticle Inspection) — Revenue($M)3		728	615	696	667	453	636	531	576	542	539	430
Patterning Systems (Overlay Metrology, Film/CD Metrology, Mask/Reticle Inspection) — Share of total revenue (company-reported %)(%)		20.0%	18.0%	21.0%	21.0%	14.0%	21.0%	17.0%	20.0%	21.0%	23.0%	17.0%
Patterning Systems (Overlay Metrology, Film/CD Metrology, Mask/Reticle Inspection) — Revenue growth YoY (company-reported %)(%)		61.0%	-3.0%	31.0%	16.0%	-16.0%	18.0%	23.0%	6.0%	-7.0%	-12.0%	-50.0%
Patterning Systems (Overlay Metrology, Film/CD Metrology, Mask/Reticle Inspection) — Revenue growth QoQ (company-reported %)(%)		18.0%	-12.0%	4.0%	47.0%	-29.0%	20.0%	-8.0%	6.0%	1.0%	25.0%	-21.0%
KLA Services (Long-Term Subscription-Like Maintenance Contracts & Upgrades across >50,000 Tools) — Revenue($M)3		820	775	786	745	703	669	667	644	614	591	565
KLA Services (Long-Term Subscription-Like Maintenance Contracts & Upgrades across >50,000 Tools) — Share of total revenue (company-reported %)(%)		22.0%	23.0%	24.0%	23.0%	22.0%	22.0%	22.0%	23.0%	24.0%	25.0%	23.0%
KLA Services (Long-Term Subscription-Like Maintenance Contracts & Upgrades across >50,000 Tools) — Revenue growth YoY (company-reported %)(%)		17.0%	16.0%	18.0%	16.0%	14.0%	13.0%	18.0%	15.0%	14.0%	12.0%	9.0%
KLA Services (Long-Term Subscription-Like Maintenance Contracts & Upgrades across >50,000 Tools) — Revenue growth QoQ (company-reported %)(%)		6.0%	-1.0%	6.0%	6.0%	5.0%	0.0%	4.0%	5.0%	4.0%	4.0%	1.0%
Specialty Semiconductor Process Systems (Systems-Only, Excl. Services) — Revenue($M)3		137	144	122	100	123	138	143	113	106	117	136
Specialty Semiconductor Process Systems (Systems-Only, Excl. Services) — Share of total revenue (company-reported %)(%)		4.0%	4.0%	4.0%	3.0%	4.0%	4.0%	5.0%	4.0%	4.0%	5.0%	6.0%
Specialty Semiconductor Process Systems (Systems-Only, Excl. Services) — Revenue growth YoY (company-reported %)(%)		11.0%	4.0%	-15.0%	-11.0%	16.0%	19.0%	5.0%	1.0%	-10.0%	1.0%	-6.0%
Specialty Semiconductor Process Systems (Systems-Only, Excl. Services) — Revenue growth QoQ (company-reported %)(%)		-5.0%	19.0%	21.0%	-19.0%	-11.0%	-3.0%	27.0%	7.0%	-9.0%	-15.0%	22.0%
PCB and Component Inspection Systems (Systems-Only, Excl. Services) — Revenue($M)3		168	95.2	80.3	117	85.4	104	93.3	72.9	74.4	68.3	77.3
PCB and Component Inspection Systems (Systems-Only, Excl. Services) — Share of total revenue (company-reported %)(%)		4.0%	3.0%	2.0%	4.0%	3.0%	3.0%	3.0%	3.0%	3.0%	3.0%	3.0%
PCB and Component Inspection Systems (Systems-Only, Excl. Services) — Revenue growth YoY (company-reported %)(%)		96.0%	-9.0%	-14.0%	61.0%	15.0%	53.0%	21.0%	2.0%	14.0%	-2.0%	-29.0%
PCB and Component Inspection Systems (Systems-Only, Excl. Services) — Revenue growth QoQ (company-reported %)(%)		76.0%	18.0%	-32.0%	37.0%	-18.0%	12.0%	28.0%	-2.0%	9.0%	-12.0%	9.0%
Other Revenue (Refurbished KLA-Pro Systems & Non-Core Products) — Revenue($M)3		23.9	46.2	40.2	42.8	39.3	19.1	79.9	66.3	63.6	57.6	111
Other Revenue (Refurbished KLA-Pro Systems & Non-Core Products) — Share of total revenue (company-reported %)(%)		1.0%	1.0%	1.0%	1.0%	1.0%	1.0%	2.0%	2.0%	2.0%	2.0%	4.0%
Other Revenue (Refurbished KLA-Pro Systems & Non-Core Products) — Revenue growth YoY (company-reported %)(%)		-39.0%	142.0%	-50.0%	-35.0%	-38.0%	-67.0%	-28.0%	-34.0%	-36.0%	-28.0%	22.0%
Other Revenue (Refurbished KLA-Pro Systems & Non-Core Products) — Revenue growth QoQ (company-reported %)(%)		-48.0%	15.0%	-6.0%	9.0%	106.0%	-76.0%	20.0%	4.0%	10.0%	-48.0%	11.0%
Total Product (Systems) Revenue — GAAP Statement of Operations split($M)		2,837	2,640	2,511	2,465	2,472	2,394	2,410	2,197	1,955	1,769	1,922

Revenue by Geographic Region (ship-to customer fab location)($M)7		3,658	3,415	3,297	3,210	3,175	3,063	3,077	2,842	2,569	2,360	2,487
Taiwan (TSMC, UMC, ASE, Nanya, Winbond, VIS) — Revenue($M)1		1,136	869	845	794	874	989	881	462	524	434	375
Taiwan (TSMC, UMC, ASE, Nanya, Winbond, VIS) — Share of total revenue (company-reported %)(%)		31.0%	26.0%	26.0%	25.0%	27.0%	32.0%	29.0%	16.0%	20.0%	18.0%	15.0%
China (Domestic Foundry, Memory & Mature-Node WFE) — Revenue($M)1		957	830	995	1,267	959	793	1,093	1,198	1,146	997	1,028
China (Domestic Foundry, Memory & Mature-Node WFE) — Share of total revenue (company-reported %)(%)		26.0%	24.0%	30.0%	39.0%	30.0%	26.0%	36.0%	42.0%	44.0%	42.0%	41.0%
North America / United States (Intel, Micron US, TSMC Arizona, GlobalFoundries, TI) — Revenue($M)1		655	410	394	298	281	294	286	501	310	247	264
North America / United States (Intel, Micron US, TSMC Arizona, GlobalFoundries, TI) — Share of total revenue (company-reported %)(%)		18.0%	12.0%	12.0%	9.0%	9.0%	10.0%	9.0%	18.0%	12.0%	10.0%	11.0%
Korea (Samsung Electronics & SK Hynix — HBM/DRAM/NAND & Foundry) — Revenue($M)1		374	681	479	299	478	379	357	239	175	201	311
Korea (Samsung Electronics & SK Hynix — HBM/DRAM/NAND & Foundry) — Share of total revenue (company-reported %)(%)		10.0%	20.0%	14.0%	9.0%	15.0%	12.0%	12.0%	8.0%	7.0%	9.0%	12.0%
Japan (Kioxia, Sony, Rapidus, TSMC JASM, Micron Hiroshima) — Revenue($M)1		211	180	229	295	377	339	229	189	171	267	298
Japan (Kioxia, Sony, Rapidus, TSMC JASM, Micron Hiroshima) — Share of total revenue (company-reported %)(%)		6.0%	5.0%	7.0%	9.0%	12.0%	11.0%	7.0%	7.0%	7.0%	11.0%	12.0%
Europe & Israel (Intel Ireland/Israel, STMicro, Infineon, imec) — Revenue($M)1		167	247	161	151	125	170	134	145	119	129	123
Europe & Israel (Intel Ireland/Israel, STMicro, Infineon, imec) — Share of total revenue (company-reported %)(%)		5.0%	7.0%	5.0%	5.0%	4.0%	6.0%	4.0%	5.0%	5.0%	6.0%	5.0%
Rest of Asia (Singapore, Malaysia, India) — Revenue($M)1		158	197	194	106	80.6	100	96.6	108	124	84.3	88.3
Rest of Asia (Singapore, Malaysia, India) — Share of total revenue (company-reported %)(%)		4.0%	6.0%	6.0%	3.0%	3.0%	3.0%	3.0%	4.0%	5.0%	4.0%	4.0%
Long-lived tangible assets (PP&E net) by country / region($M)5		1,381	1,364	1,345	1,302	1,253	1,198	1,174	1,118	1,110	1,106	1,089
United States — Long-lived assets (Milpitas HQ, Ann Arbor R&D/Mfg)($M)		771	769	765	739	728	711	701	691	690	701	696
Singapore — Long-lived assets (Primary Asian Manufacturing Hub)($M)		192	179	166	160	153	152	148	146	149	151	153
Israel — Long-lived assets (Migdal HaEmek & Yavne Metrology/Orbotech R&D & Mfg)($M)		55	59.2	62.4	66.3	68.6	72	75.7	81	84.3	89.4	90.8
Europe — Long-lived assets (Newport Wales SPTS, Belgium, Germany)($M)		290	285	281	272	254	231	218	168	156	130	110
Rest of Asia — Long-lived assets (Taiwan, China, Korea, Japan, India)($M)		73.1	71.8	71.3	63.7	49.1	32.1	31	32.4	31.4	35	38.2
Trade accounts receivable sold without recourse under factoring agreements($M)1		229	109	70.4	106	87.1	59.7	38.2	45.5	74.7	85.5	49.1
Proceeds from sale of letters of credit & banker's acceptances from customers($M)		42.9	22.1	2.80	18.2	0	20.2	33.4	2	0	8.30	13.9

Total inventories, net($M)5		3,649	3,437	3,283	3,297	3,212	3,156	3,046	3,110	3,035	3,007	3,039
Raw materials (optical components, lasers, sensors, sub-assemblies)($M)		1,850	1,648	1,569	1,537	1,492	1,461	1,409	1,490	1,485	1,513	1,560
Work-in-process (WIP — wafer inspection & metrology systems in cleanroom assembly)($M)		938	930	836	860	834	809	768	737	701	674	621
Customer service parts (field spare parts supporting KLA's >50,000 installed base tools)($M)		623	603	626	608	601	586	586	602	590	595	586
Finished goods & customer demonstration / evaluation systems($M)		238	257	252	293	286	300	283	281	259	225	271
Stock-based compensation capitalized into inventory($M)		34	32.5	27.2	26.9	26.3	25.7	21.5	21.7	21.5	21.4	20.9
Property, plant and equipment (PP&E), gross($M)8		3,070	2,998	2,934	2,840	2,739	2,634	2,562	2,448	2,395	2,347	2,289
Machinery, cleanroom test & R&D equipment($M)		1,418	1,374	1,338	1,295	1,239	1,192	1,165	1,139	1,117	1,096	1,076
Buildings and leasehold improvements($M)		1,254	1,237	1,222	1,179	1,132	1,000	987	925	920	923	873
Construction-in-process (cleanroom & facility expansion underway)($M)		224	221	211	204	208	287	256	241	215	186	201
Land($M)		86.7	86.7	86.7	86.7	86.7	86.7	86.7	78.3	78.3	78.3	78.3
Office furniture and fixtures($M)		86.1	80.5	77.2	75.2	74	68.7	67.6	64.4	64.5	64.1	61.1
Less: Accumulated depreciation and amortization($M)		1,689	1,635	1,589	1,538	1,487	1,436	1,388	1,330	1,285	1,241	1,201
Property, plant and equipment (PP&E), net($M)		1,381	1,364	1,345	1,302	1,253	1,198	1,174	1,118	1,110	1,106	1,089
Total depreciation and amortization expense($M)1		98.6	99.1	99.3	97	96.2	98.1	104	95.8	101	99.3	99.1
Amortization of purchased intangible assets($M)		45	47.3	49.3	49.3	50.9	53.9	58.9	56.8	58.9	57.8	59.4
Operating lease right-of-use (ROU) assets($M)5		335	332	294	270	270	268	249	251	232	241	235
Total operating lease liabilities($M)2		264	258	223	203	204	206	190	195	190	195	192
Current operating lease liabilities($M)		52.9	51.1	51	46.8	45.2	43.5	40.6	40.4	36.4	36.4	35.4
Non-current operating lease liabilities($M)		211	207	172	156	159	162	150	154	153	158	156
Operating lease cost (income statement expense)($M)		16.9	16.6	14.3	13.6	13.5	13.1	11.9	13.1	16.1	13.3	12.9
Operating cash outflows for operating leases($M)		15.3	13.9	13.8	13.6	13.4	12.5	10.4	10.9	10.3	10.6	10.5
Weighted-average discount rate on operating leases (%)(%)		3.7%	3.8%	3.8%	4.1%	4.1%	4.1%	4.3%	4.2%	4.3%	4.2%	4.0%
Total undiscounted future operating lease payments($M)5		302	296	251	232	234	238	222	228	224	231	226
Lease payments due in Year 1($M)		62.5	59	57.6	50.2	53.2	50	46.2	44.3	43.6	44.2	41.8
Lease payments due in Year 2($M)		54.2	49.3	38.4	31.2	47.1	44.2	35	33.3	38.4	36.8	34.4
Lease payments due in Year 3($M)		42.6	38.9	32	25.7	28.7	27.5	23.8	22.8	31	29.7	27.8
Lease payments due in Year 4($M)		38.6	35.1	29.6	23.2	24	23.4	20.6	20	21.7	21.2	19.5
Less: Imputed interest on operating leases($M)		37.2	38.1	28.1	28.5	30	31.6	31.4	33.1	34.7	36.2	34.4

Non-GAAP gross margin (% of revenue)(%)4		62.4%	62.2%	62.6%	62.5%	63.2%	63.0%	61.7%	61.2%	62.5%	59.8%	62.6%
Non-GAAP operating margin (% of revenue)(%)		43.7%	42.6%	42.8%	43.2%	44.2%	44.2%	42.3%	41.5%	41.0%	36.8%	40.7%
Non-GAAP operating expenses ($M)($M)3		682	670	653	618	603	575	596	560	553		544
Non-GAAP research & development (R&D) expense ($M)($M)		399	389	384	360	353	338	342	322	324	320	320
Non-GAAP selling, general & administrative (SG&A) expense ($M)($M)		283	281	269	258	250	237	254	238	229	224	224
Non-GAAP other income & expense (OIE), net ($M expense)($M)		16	-9	32	28	23	36	31	41	32	34	42
Non-GAAP effective tax rate (%)(%)		12.4%	15.4%	15.0%	14.1%	9.9%	15.0%	13.7%	13.2%	12.6%	14.2%	13.6%
Non-GAAP net income attributable to KLA ($M)($M)3		1,386	1,239	1,168	1,167	1,244	1,121	1,098	988	893	715	839
Reconciling adjustment: Pre-tax acquisition-related charges ($M)($M)		33.1	47	49	49	50.7	53.7	58.7	56.7	58.8	58.6	59.3
Reconciling adjustment: Income tax effect of Non-GAAP adjustments ($M)($M)		-17.2	-17.7	-18.1	-18.3	-18.6	-18.3	-23.2	-19.5	-23.2	-19.9	-22.8
Reconciling adjustment: Discrete tax items ($M)($M)		6.80	8.30	-8.40	15.1	7.30	-3.10	-2.80	2.20	3.10	2.40	-0.10
Free cash flow (Non-GAAP: Operating Cash Flow minus Capital Expenditures)($M)3		817	622	1,262	1,066	1,065	990	757	935	832	838	545
Free cash flow margin (FCF % of revenue, quarterly)(%)		22.0%	18.0%	38.0%	33.0%	34.0%	32.0%	25.0%	33.0%	32.0%	36.0%
LTM free cash flow margin (% of LTM revenue)(%)		28.0%	31.0%	34.0%	31.0%	31.0%	30.0%	31.0%	31.0%	31.0%	32.0%
Free cash flow conversion (FCF % of Non-GAAP net income)(%)		59.0%	50.0%	108.0%	91.0%	86.0%	88.0%	69.0%	95.0%	93.0%	117.0%
Total capital returns to shareholders (share repurchases + dividends paid)($M)3		876	875	797	799	680	733	877	766	668	569	635
LTM total capital returns to shareholders($M)		3,300	3,200	3,000	3,090	3,050	3,000	2,900	2,600	2,500	2,400
Common stock repurchases — cash settlement basis (cash flow statement)($M)3		571	626	548	545	426	507	650	567	470	372	438
Common stock repurchases — trade-date cost basis (Note 13)($M)		570	632	538	564	427	512	656	571	466	376	442
Common shares repurchased (millions of shares, split-adjusted in FY26)(M)		16.7	0.44	0.46	0.62	27.6	0.71	0.98	0.74	27.9	0.59	0.85
Remaining share repurchase authorization ($9,740M at Q4 FY26)($M)		9,740	10,310	3,940	4,470	5,030	457	963	1,610	2,180	2,640	3,020
Cash dividends paid to stockholders($M)		305	249	250	254	254	226	227	198	198	197	197
Total cash, cash equivalents and marketable securities (Slide 7 balance sheet summary)($M)4		4,902	4,958	5,207	4,684	4,495	4,029	3,780	4,630	4,504	4,294	3,343
Working capital (company-reported on Slide 7)($M)		8,077	7,599	7,281	6,851	6,613	6,035	5,634	5,430	5,370	5,070	4,178
Total debt carrying value (Senior Notes)($M)2		5,887	5,887	5,886	5,885	5,884	5,883	5,882	6,631	6,630	6,629	5,893
Weighted-average interest rate on Senior Notes portfolio (%)(%)		4.7%	4.7%	4.7%	4.7%	4.7%	4.7%	4.7%	4.7%	4.7%	4.7%	4.6%
Weighted-average remaining maturity of Senior Notes portfolio (years)(years)		18.1	18.3	18.6	18.8	19.1	19.3	19.6	17.6	17.9	18.1	18.6
Unrecognized stock-based compensation cost for unvested RSUs($M)		558	436	494	551	486	386	440	485	428	337	380
Committed future cash long-term incentive (LTI) awards($M)		101	115	116	117	120	135	136	142	143	163	168

Semiconductor & AI Hyperscaler Customer Quarterly Cash CapEx (aligned to KLA's fiscal quarters through Q1 FY27)6
Micron Technology (Leading DRAM & HBM3E/HBM4 Memory Customer) — Quarterly cash CapEx($M)	11,110	7,826	6,387	5,389	5,658	2,938	4,055	3,206	3,120	2,086	1,384	1,796
Intel Corporation (Leading Logic Foundry & Advanced Packaging Customer) — Quarterly cash CapEx($M)		2,556	3,636	3,488	2,425	3,550	5,183	5,834	6,458	5,682	5,970	6,696
Microsoft Corporation (AI Cloud Hyperscaler CapEx Driver) — Quarterly cash CapEx($M)		35,802	30,876	29,876	19,394	17,079	16,745	15,804	14,923	13,873	10,952	9,735
Alphabet / Google (AI Cloud & TPU Hyperscaler CapEx Driver) — Quarterly cash CapEx($M)		44,924	35,674	27,851	23,953	22,446	17,197	14,276	13,061	13,186	12,012	11,019
Amazon / AWS (AI Cloud & Trainium Hyperscaler CapEx Driver) — Quarterly cash CapEx($M)		54,208	44,203	39,522	35,095	32,183	25,019	27,834	22,620	17,620	14,925	14,588
Meta Platforms (AI Infrastructure Hyperscaler CapEx Driver) — Quarterly cash CapEx($M)	33,942	30,116	18,997	21,383	18,829	16,538	12,941	14,425	8,258	8,173	6,400	7,592

Total revenues (GAAP)($M)6		3,658	3,415	3,297	3,210	3,175	3,063	3,077	2,842	2,569	2,360	2,487
Costs of revenues (GAAP)($M)		1,413	1,328	1,271	1,243	1,207	1,176	1,222	1,147	1,011	994	977
Research and development (R&D) expense (GAAP)($M)		399	389	384	361	353	338	346	323	326	322	320
Selling, general and administrative (SG&A) expense (GAAP)($M)		292	291	280	269	263	249	267	251	255	238	237
Restructuring, severance and other charges($M)		0.30	0.20	0.30	0.40	2.10	0.60	2.10	2.90	17.7	2	1.30
Goodwill and intangible asset impairment charges($M)		0	0	0		0	0	239		0	70.5	219
Total costs and expenses (GAAP)($M)		2,104	2,008	1,935	1,873	1,823	1,763	2,074	1,722	1,591	1,624	1,753
Income before income taxes (GAAP)($M)4		1,549	1,417	1,330	1,310	1,329	1,264	973	1,079	945	702	691
Interest expense($M)		73.3	70.4	69.7	71.1	73.1	71.9	75	82.2	82.8	80	74.2
Other expense (income), net($M)		68.7	79.7	37.8	43.4	50.2	35.9	44.5	40.9	50.6	45.6	32.2
Provision for income taxes (GAAP)($M)		186	216	185	188	126	176	148	133	109	101	109
Net income attributable to KLA (GAAP)($M)		1,363	1,201	1,146	1,121	1,203	1,088	825	946	836	602	583
Net cash provided by operating activities (GAAP operating cash flow)($M)10		906	708	1,368	1,162	1,165	1,072	850	995	893	910	622
Capital expenditures (cash paid for PP&E, positive display)($M)		89.3	85.2	106	95.9	100	82.1	92.3	60.4	60.7	71.8	76.8
Stock-based compensation expense (cash flow statement)($M)		82.1	83.9	73.9	70.2	71.3	70.2	61.8	61.7	58.6	56.7	48.6
Depreciation and amortization (cash flow statement)($M)		98.6	99.1	99.3	97	96.3	98.1	104	95.8	101	99.3	99.1
Cash flow from change in accounts receivable($M)		-585	-231	204	-13.8	-104	175	-382	-120	-208	219	-213
Cash flow from change in inventories($M)		-212	-159	1.20	-95.7	-48.5	-112	65	-59.3	-32.8	28.4	-21.2
Cash flow from change in accounts payable($M)		108	93.3	-5	-23.7	-8.60	-12.2	67.1	-12.5	24.2	-10.2	2.70
Net cash used in investing activities($M)		-173	-494	-113	-410	-325	-320	614	-171	-139	-858	-88.5
Net cash used in financing activities($M)		-877	-879	-748	-882	-630	-735	-1,583	-838	-619	139	-591
Cash paid for income taxes($M)		199	180	284	119	231	198	362	96.4	65.6	160	506
Cash paid for interest($M)		11.9	131	7.70	132	7.80	129	25.1	131	25.2	113	24.8
Total assets (GAAP balance sheet)($M)10		17,952	16,874	16,720	16,318	16,068	15,188	15,002	15,682	15,434	14,957	14,281
Cash and cash equivalents($M)		1,650	1,787	2,452	1,946	2,079	1,858	1,838	1,977	1,977	1,848	1,665
Accounts receivable, net($M)		2,889	2,305	2,074	2,278	2,264	2,160	2,335	1,953	1,833	1,625	1,844
Inventories, net($M)		3,649	3,437	3,283	3,297	3,212	3,156	3,046	3,110	3,035	3,007	3,039
Other current assets($M)		942	652	700	642	728	601	611	536	659	602	523
Total current assets($M)		12,382	11,351	11,264	10,901	10,699	9,945	9,773	10,228	10,031	9,528	8,749
Property, plant and equipment, net($M)		1,381	1,364	1,345	1,302	1,253	1,198	1,174	1,118	1,110	1,106	1,089
Goodwill, net($M)		1,789	1,789	1,791	1,791	1,792	1,788	1,785	2,016	2,016	2,016	2,086
Purchased intangible assets, net($M)		256	301	348	397	445	496	549	612	669	728	786
Deferred income taxes (non-current asset)($M)		1,037	1,123	1,144	1,131	1,106	1,023	1,002	982	915	879	902
Other non-current assets($M)		1,107	946	829	795	774	739	719	726	693	700	668
Total liabilities (GAAP balance sheet)($M)6		11,602	11,043	11,255	11,333	11,376	11,184	11,417	12,122	12,065	11,862	11,237
Accounts payable($M)		624	515	425	430	459	429	433	377	360	355	377
Other current liabilities (incl. contract liabilities & customer deposits)($M)		2,144	2,039	2,100	2,197	2,262	2,103	2,111	2,282	2,064	1,909	2,114
Total current liabilities($M)		4,305	3,752	3,983	4,050	4,086	3,910	4,138	4,798	4,661	4,459	4,571
Other non-current liabilities($M)		698	709	663	646	610	633	639	651	743	773	807
Total stockholders' equity($M)		6,350	5,831	5,466	4,985	4,693	4,005	3,585	3,560	3,368	3,095	3,044
Retained earnings($M)		3,684	3,188	2,861	2,495	2,179	1,646	1,285	1,328	1,137	959	922

Italic numbers are calculated by StockData from reported figures (hover for the formula). Numbers with a dotted underline are read from the text of earnings releases and presentations; hover to see the exact sentence. Tick a row to add it to the chart above (up to 8 lines).

Methodology and excluded metrics

Fiscal calendar & 10-for-1 stock split: KLA's fiscal year ends on June 30 (Q1 = Jul–Sep, Q2 = Oct–Dec, Q3 = Jan–Mar, Q4 = Apr–Jun). On June 11, 2026, KLA effected a 10-for-1 stock split; historical share and per-share figures in the database have been retroactively adjusted. Latest reported period: Q4 FY26 & Full-Year FY2026 (ended June 30, 2026).
Forward column (Q1 FY27): Column Q1 FY27 (quarter ending September 30, 2026) displays KLA's official Q1 FY27 guidance issued on July 28, 2026 ($4,000M ± $200M revenue, 62.5% ± 1.0% Non-GAAP gross margin, 61.6% ± 1.0% GAAP gross margin, ~$690M Non-GAAP OpEx, ~$25M Non-GAAP OIE net expense, 14.5% Non-GAAP tax rate, and Semi Process Control system customer mix of ~73% Foundry/Logic vs. ~27% Memory with ~90% DRAM / ~10% NAND) alongside calendar Q3 2026 cash CapEx already reported by Micron, Microsoft, Alphabet, Amazon, and Meta.
Core operational drivers (Foundry/Logic vs. Memory DRAM/NAND Mix, $12.57B Backlog, $5.97B Purchase Commitments & $623M Service Spare Parts): KLA's Shareholder Letters and Earnings Slides disclose the quarterly customer end-market split of Semiconductor Process Control system sales (~79% Foundry/Logic and ~21% Memory in Q4 FY26, with Memory split ~83% DRAM / ~17% NAND). Total backlog jumped +59.9% YoY to $12.57B at FY26, contract liabilities reached $1,775.1M, unconditional purchase commitments surged +95.1% YoY to $5,970.0M, and customer service spare parts inventory reached $622.7M supporting KLA's >50,000 installed base tools.
Taiwan Monthly Supply Chain & Customer Revenue Tracker (MOPS): Taiwan is KLA's #1 geographic market (31% of Q4 FY26 revenue), led by TSMC (~22% of FY26 total revenue). Monthly columns (Jan 2018 – Sep 2026, 105 consecutive months) track NT$M operating revenue, YoY %, and MoM % from MOPS for TSMC (2330.TW), UMC (2303.TW), VIS (5347.TW), ASE Technology (3711.TW), KYEC (2449.TW), Nanya Technology (2408.TW), Winbond (2344.TW), and Unimicron (3037.TW) through September 2026 — covering all 3 months of KLA's Q1 FY27 ahead of KLA's financial release.
Bound & single-period disclosures excluded from numeric cells per Step 4 & Step 5 rules and recorded here: Active patents ('over 9,100 active patents and over 3,600 pending applications as of June 30, 2026'), KLA Services subscription-like contract revenue share ('75%+ of service revenue from 3-year comprehensive service contracts') and active installed base ('>50,000 systems in the field'), CY25 Advanced Packaging revenue ('more than $925M in CY25, expected to grow >25% in CY26'), and Investor Day CY25 Process Control market share (56.6% total Process Control, >85% patterned optical inspection, >65% e-beam inspection, >55% overlay metrology).
Subsidiary & parent-only evaluation: KLA reports under U.S. GAAP with no standalone parent-company financial statements (Schedule I is not required), so consolidated − standalone subtraction does not apply.
Strict Step 4 & Step 5 compliance: Every cell displays a figure directly published by KLA or an authoritative external source (SEC XBRL, MOPS), plus the two permitted period splits (Q4 = full year − nine months and quarterly cash flow = YTD − prior YTD, shown in italics with formula). Any series lacking the 3 most recent consecutive quarters/months or 2 most recent fiscal years is automatically pruned into excluded.

Not shown because recent periods are missing (21)

1. Order Backlog ($12.57B), Contract Liabilities ($1.78B), Customer Deposits & Supply Commitments ($5.97B) › Total order backlog (systems & services performance obligations) › Remaining performance obligations (RPO — quarterly XBRL disclosure prior to FY26)
1. Order Backlog ($12.57B), Contract Liabilities ($1.78B), Customer Deposits & Supply Commitments ($5.97B) › Total contract liabilities (deferred system & service revenue) › Revenue recognized upon customer acceptance conditions other than passage of time
4. Reportable Segments & Major Product Categories (Revenue, Segment Profit & Cost Structure under ASU 2023-07, Share %, YoY & QoQ %) › Total consolidated revenue across reportable segments › Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment revenue › Semiconductor Process Control (Wafer Inspection, Patterning & Services) — Segment gross goodwill (historical disclosure)
4. Reportable Segments & Major Product Categories (Revenue, Segment Profit & Cost Structure under ASU 2023-07, Share %, YoY & QoQ %) › Total consolidated revenue across reportable segments › Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment revenue › Specialty Semiconductor Process (Advanced Packaging, Etch/Deposition for MEMS/RF/Power) — Segment gross goodwill (historical disclosure)
4. Reportable Segments & Major Product Categories (Revenue, Segment Profit & Cost Structure under ASU 2023-07, Share %, YoY & QoQ %) › Total consolidated revenue across reportable segments › PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment revenue › PCB and Component Inspection (IC Substrate, HDI PCB & Component Inspection) — Segment gross goodwill (historical disclosure)
5. Geographic Revenue & Manufacturing Footprint, Major Customer Concentration (TSMC) & Receivables Factoring › Largest single customer concentration (TSMC) — share of annual revenue (%) › Largest single customer concentration — quarterly 10-Q disclosures (%)
6. Inventory by Manufacturing Stage (incl. $623M Service Spare Parts), Cleanroom PP&E & Operating Leases › Total inventories, net › Standard product warranty accrual (historical XBRL disclosure)
7. Non-GAAP Profitability, Free Cash Flow Generation, Capital Returns ($9.74B Buyback Auth) & Debt Profile › Non-GAAP gross margin (% of revenue) › Incremental operating margin YoY (stated quarters)
7. Non-GAAP Profitability, Free Cash Flow Generation, Capital Returns ($9.74B Buyback Auth) & Debt Profile › Free cash flow (Non-GAAP: Operating Cash Flow minus Capital Expenditures) › LTM free cash flow (stated in Q1–Q3 Shareholder Letters)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Total Scope 1 & Scope 2 (market-based) GHG emissions (tCO2e)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Scope 1 direct GHG emissions (tCO2e)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Scope 2 location-based GHG emissions (tCO2e)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Scope 2 market-based GHG emissions (tCO2e)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Scope 3 value chain GHG emissions (million MT CO2e)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Total energy consumed (MWh)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Purchased grid electricity (MWh)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Renewable portion of grid electricity (MWh)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Energy Attribute Certificates (EACs) retired (MWh)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Total purchased renewable electricity (MWh)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: Renewable electricity share (%)
8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint › ESG: U.S. Total Recordable Incident Rate (TRIR)

Data updated 2026-10-25.

Every KPI on its own page

Full history, chart, sources and a citation for each metric

KLA Corp (KLAC) operating KPIs

KPIs

Every KPI on its own page

1. Order Backlog ($12.57B), Contract Liabilities ($1.78B), Customer Deposits & Supply Commitments ($5.97B)

2. Semiconductor Process Control Systems — Customer End-Market Mix (Foundry/Logic vs. Memory DRAM/NAND, Actuals & Guidance)

3. Next-Quarter Financial & Operational Guidance (Through Q1 FY27 Outlook)

4. Reportable Segments & Major Product Categories (Revenue, Segment Profit & Cost Structure under ASU 2023-07, Share %, YoY & QoQ %)

5. Geographic Revenue & Manufacturing Footprint, Major Customer Concentration (TSMC) & Receivables Factoring

6. Inventory by Manufacturing Stage (incl. $623M Service Spare Parts), Cleanroom PP&E & Operating Leases

7. Non-GAAP Profitability, Free Cash Flow Generation, Capital Returns ($9.74B Buyback Auth) & Debt Profile

8. Global Workforce (By Region & Engineering/Service Function) & Tax Footprint

9. Customer Cash CapEx (Through Q1 FY27) & Taiwan Semiconductor / Packaging Monthly Revenue (MOPS Through Sep 2026)

10. Consolidated GAAP Financial Statement Context (Income Statement, Cash Flow & Balance Sheet from PostgreSQL DB)