AMKOR TECHNOLOGY, INC.

Amkor Technology, Inc. provides outsourced semiconductor packaging and testing services, handling post-wafer fabrication assembly and verification for electronic components. The company operates primarily through two segments: Advanced Products, which features flip-chip, wafer-level processing, and system-in-package architectures, and Mainstream Products, encompassing wirebond, leadframe, and micro-electro-mechanical systems packaging. Its turnkey solutions also include wafer bumping, probe testing, burn-in, and final distribution. Amkor serves integrated device manufacturers, fabless chip designers, original equipment manufacturers, and contract foundries across communications, computing, automotive, and consumer electronics markets.

The company operates manufacturing facilities across Asia and Europe, with additional production capacity expanding via an operational plant in Vietnam and a facility under construction in Arizona. Its worldwide operations are supported by sales and technical offices situated across the United States, Europe, and Asia, alongside a key research center of excellence in Korea. Amkor maintains its corporate headquarters in the United States.

Summary of the business section of Amkor Technology's latest annual report, written by StockData.

“Actually paid” adjusts reported pay for changes in the value of equity awards. Shareholder return assumes $100 invested at the start of the measurement period, as disclosed by the company.

“As of December 31, 2025, Amkor employed 30,800 employees, of whom approximately 95%, 4% and 1% resided in the Asia-Pacific region, Europe and the United States, respectively.”