Taiwan Semiconductor Manufacturing Co Ltd (TSM) bonds

TSMNYSESemiconductors & Related DevicesFiscal year ends December 31Also trades as TSMWF

Financials through fiscal 2025, year ended Dec 31, 2025Last filing: 20-F on Apr 16, 2026Score 16/30

$406.13−25.68 (-5.95%)

Close on Oct 30, 2026Market cap $2.11TP/E 40.4Yield –

Debt

Borrowings on the balance sheet, Dec 31, 2025

Total debt

176.76B TWD

136.93B TWD due within a year

Net debt

-2.59T TWD

After 2.77T TWD of cash

Implied interest rate

9.22%

FY2025 interest ÷ average debt

Interest coverage

156.5×

FY2025 operating income ÷ interest

Long-term plus current debt, TWD

Individual notes, bonds and loans

The debt footnote in the annual report has no machine-readable detail for individual notes, so coupons and maturities cannot be listed.

Parsed from the XBRL in Taiwan Semiconductor Manufacturing's annual and quarterly filings with the SEC
Per-share figures adjusted for the 11-for-10 split on Jun 19, 2002
Fourth quarters derived from the annual report minus nine months
Every figure in the statements links to its source filing

Trailing twelve months. Peers are matched on business description, industry and size. Ticks are peers, the dot is TSM.

Revenue growth31.6% · median 83.4%

Gross margin59.9% · median 74.7%

Operating margin50.8% · median 65.2%

Net margin44.6% · median 63.7%

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