Corning Inc (GLW) operating KPIs
GLWNYSEDrawing & Insulating of Nonferrous WireFiscal year ends December 31
Financials through Q3 FY2026, quarter ended Sep 30, 2026Last filing: 10-Q on Oct 29, 2026Score 16/3073% above fair value
$123.31−5.57 (-4.32%)
Close on Oct 30, 2026Market cap $106.22BP/E 49.9Yield 0.91%
Corning hemlock Semiconductor Group (HSG) — Multiyear Take-or-Pay Contract Liabilities ($M, annual) ($M)
Annual figures from Corning's filings and investor materials
Latest, FY2025
775
Period ended Dec 31, 2025
Change on a year earlier
-7.0%
833 in FY2024
History
6 years
Since FY2020
Sources
6
Documents cited below
Annual history
Hover a value to see the sentence it was read from; calculated values show their formula
| Period | Ended | Hemlock Semiconductor Group (HSG) — Multiyear Take-or-Pay Contract Liabilities ($M, annual) ($M) | Year on year | Source |
|---|---|---|---|---|
| FY2025 | Dec 31, 2025 | 775 | -7.0% | Corning Form 10-Q (filed 2026-05-01) ↗ |
| FY2024 | Dec 31, 2024 | 833 | -3.1% | Corning Form 10-K (filed 2026-02-12) ↗ |
| FY2023 | Dec 31, 2023 | 860 | -1.0% | Corning Form 10-K (filed 2025-02-13) ↗ |
| FY2022 | Dec 31, 2022 | 869 | -4.7% | Corning Form 10-K (filed 2024-02-12) ↗ |
| FY2021 | Dec 31, 2021 | 912 | -8.8% | Corning Form 10-K (filed 2023-02-13) ↗ |
| FY2020 | Dec 31, 2020 | 1,000 | – | Corning Form 10-K (filed 2022-02-14) ↗ |
Cite this data
StockData. (2026). Corning Hemlock Semiconductor Group (HSG) — Multiyear Take-or-Pay Contract Liabilities ($M, annual) ($M), annual FY2020–FY2025 [Data set]. Compiled from Corning SEC filings and investor materials. https://stockdatahq.com/stocks/glw/kpis/def-rev-hsg
See every metric in the Corning KPI table. Data updated Oct 28, 2026.